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Once the predominant method for mass assembly of circuit boards, wave soldering has taken a back seat to oven-based reflow soldering. The ease of surface mounting led to a rapid rise in popularity of oven-based technology, and proliferation of surface-mountable packages has led to a decreased reliance on wave soldering. Nonetheless, through-hole componentry persists and mixed-mount (surface-mount plus through-hole) technology still may be the only alternative for some assemblies, and it is unlikely that wave soldering will disappear from PWB manufacturing in the short term. Since wave soldering, compared to reflow soldering, is fraught with defects, it behooves the designer and assembler to minimize the number of PTH components on a board.

Wave-Solder Process Basics Wave soldering utilizes a reservoir of molten solder pumped and circulated to form a standing wave. The circuit board is prepared with devices for wave soldering in one of three ways:

Coarse-pitch surface-mount components, especially passive devices, are affixed to the bottom side of the PWB using surface-mount adhesive. The adhesive is cured prior to wave soldering. The adhesive is in contact with the body of the component, which is aligned with its respective pads on the circuit board in preparation for wave soldering. Solder-tailed components such as connectors, PGAs, or other through-hole devices are inserted into PTHs from the top side of the board. Solder-tailed components such as axially leaded devices are inserted from the top side of the circuit board, whereas the leads are clinched on the bottom side of the board.

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The circuit board is placed on a motorized, edge-hold conveyor where it is fluxed, then preheated both to activate the flux and give the PWB a thermal boost.The board is next skimmed over the crest of the molten solder wave. Only the bottom of the circuit board is exposed to the molten solder (see Fig. 47.22).

which scaling is very important [6]

FIGURE 47.22 Schematic of a board going over a solder wave.The board is conveyed over the pumped standing wave of molten solder. Only the secondary side of the board is exposed to the wave. The wave height is set to contact the bottom of the board very slightly.

At the falling edge of the 9th SCLK signal, the ADC outputs data on the Dout signal, one bit for each of the next 15 falling edges of the SCLK signal The data on the 9th pulse is 0 and the actual conversion result is effective after the 10th falling edge to the 21st rising edge Thereafter, for the next 3 edges, the ADC outputs 0 s For a controller circuit such as the AVR, with minimal parts, to initiate conversion and readout the result would need three output bits and one input bit The output bits would be needed to generate the Din and SCLK signal and the input bit to read the Dout signal from the ADC Figure 619 illustrates the circuit with a MAX186 ADC, an AT90S2313 processor, and a MAX232 RS-232 level translator The circuit is connected to the PC serial port.

When exposed to the wave, the adhesive-attached surface-mount devices pick up solder on their metal contacts and the solder bridges from the contact to its corresponding bonding pad on the bottom side of the PWB. In the case of solder-tail components, the molten solder is drawn by capillary action between the lead and the PTH barrel. If the barrel and lead are hot enough and well fluxed, the solder fills up the barrel and wick to form fillets from pin to barrel. As the board continues past the wave, it cools, solder solidifies, and joint formation is complete. One attribute of this process is the speed at which solder joints are formed. Much quicker than oven reflow soldering, the wave-solder process allows little time for preheating, fluxing, and solder-joint formation, which also explains the variability of this process.

Wave-Solder Machine Subsystems There are five basic subsystems of a wave soldering machine, including conveyors, fluxers, preheaters, solder pots with pumps and heaters, and ventilation. If alcohol-based fluxes are being used, it is wise to install a fire suppression system also. 47.4.2.1 Conveyor. As for the reflow oven, the wave solder machine is generally equipped with a mechanized, speed-controlled conveyor to transport the board through the soldering process. In the case of wave soldering, the board is always held by a width adjustable edge-finger conveyor, which grabs the board by its edges and neither occludes solder exposure nor interferes with wave dynamics. The stainless-steel edge fingers need to be cleaned routinely to avoid flux build-up. 47.4.2.2 Fluxer. The fluxer is responsible for delivering a uniform application of soldering flux in a sufficient quantity for solder-joint formation. The short preheat and liquidus times characteristic of the wave-soldering process dictate the use of slightly stronger fluxing agents

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